Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection

VK Mathew, TK Hotta - Thermal Science and Engineering Progress, 2018 - Elsevier
The paper aims to investigate numerically the mixed convection heat transfer characteristics
from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply …

[PDF][PDF] Experimental investigation of heat transfer from symmetric and asymmetric IC Chips mounted on the SMPS board with and without PCM

AS Kurhade, AA Kadam, R Biradar… - J Adv Res Fluid Mech …, 2024 - researchgate.net
In the present study the experiments were conducted on steady-state that incorporated nine
symmetric and asymmetric separate discrete integrated circuits (ICs), strategically positioned …

Optimized distribution of a large number of power electronics components cooled by conjugate turbulent natural convection

A Baudoin, D Saury, C Boström - Applied Thermal Engineering, 2017 - Elsevier
Natural convection allows for passive cooling which is used in many engineering
applications. Placing dissipating components on a common vertical heatsink can be …

Temperature and velocity measurements in a buoyant flow induced by a heat source array on a vertical plate

A Baudoin, D Saury - Experimental Thermal and Fluid Science, 2017 - Elsevier
Heat source arrays are common in engineering applications. Natural convection is a reliable
and silent cooling strategy. Therefore, an array of flush-mounted heat sources has been …

Free convective heat transfer in a closed gap between concentric semi-hemispheres

A Baïri, N Alilat, A Martín-Garín, K Adeyeye… - Energies, 2021 - mdpi.com
Free convective heat transfer in the closed gap between concentric semi-hemispheres is
quantified by means of a numerical approach based on the volume control method using the …

[PDF][PDF] Computational Study on Thermal Management of IC Chips with Phase Change Materials

AS Kurhade, PS Bhambare, GD Siraskar, S Mukesh… - researchgate.net
This paper introduces an implicit transient numerical formulation for a novel passive thermal
management system designed to cool heterogeneous IC chips on a substrate board using …

[CITATION][C] Thermal Science and Engineering Progress

VK Mathew, TK Hotta