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Multi-port gas injection system and reactor system including same
MA Mingyang, J Su, A Demos, X Lin, S Kim… - US Patent …, 2021 - Google Patents
A gas injection system, a reactor system including the gas injection system, and methods of
using the gas injection system and reactor system are disclosed. The gas injection system …
using the gas injection system and reactor system are disclosed. The gas injection system …
Vertical furnace for processing substrates and a liner for use therein
F Wiegers - US Patent 10,883,175, 2021 - Google Patents
5,158,128 A D330, 900 S 5,167,716 A 5,176,451 A 5,178,682 A 5,181,779 A 5,183,511 A
5,192,717 A 5,194,401 A 5,199,603 A 5,213,650 A 5,221,556 A 5,225,366 A 5,226,383 A …
5,192,717 A 5,194,401 A 5,199,603 A 5,213,650 A 5,221,556 A 5,225,366 A 5,226,383 A …
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
A method of forming an electrode on a substrate is disclosed. The method may include:
contacting the substrate with a first vapor phase reactant comprising a titanium tetraiodide …
contacting the substrate with a first vapor phase reactant comprising a titanium tetraiodide …
Substrate processing method and device manufactured by using the same
YK Min - US Patent 11,361,990, 2022 - Google Patents
H01L21/02263—Forming insulating materials on a substrate characterised by the process
for the formation of the insulating layer formation by a deposition process deposition from the …
for the formation of the insulating layer formation by a deposition process deposition from the …
Substrate processing system
YK Min, Y Kim, H Lee, SJ Chun - US Patent 11,530,483, 2022 - Google Patents
2019-08-30 Assigned to ASM IP HOLDING BV reassignment ASM IP HOLDING BV
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
Diaphragm valves, valve components, and methods for forming valve components
J Shugrue - US Patent 10,767,789, 2020 - Google Patents
Int. Ci. F16K 49/00(2006.01) F16K 7/14(2006.01) HO5B 3/34(2006.01) H05B
1/02(2006.01)(52) US Cl.??? F16K 49/002 (2013.01); F16K 7/14 (2013.01); HO5B 1/0233 …
1/02(2006.01)(52) US Cl.??? F16K 49/002 (2013.01); F16K 7/14 (2013.01); HO5B 1/0233 …
Temperature-controlled flange and reactor system including same
(57) ABSTRACT A flange, flange assembly, and reactor system including the flange and
flange assembly are disclosed. An exemplary flange assembly includes heated and cooled …
flange assembly are disclosed. An exemplary flange assembly includes heated and cooled …
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
TJV Blanquart, M Utsuno, S Yoshio… - US Patent …, 2020 - Google Patents
2020-03-30 Assigned to ASM IP HOLDING BV reassignment ASM IP HOLDING BV
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
Substrate processing method
SW Choi - US Patent 10,867,786, 2020 - Google Patents
A substrate processing method capable of uniformly main taining damage to a pattern
structure under a thin film formed on a substrate includes supplying a source material to a …
structure under a thin film formed on a substrate includes supplying a source material to a …
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a …
T Hatanpää, K Väyrynen, M Ritala… - US Patent 10,731,249, 2020 - Google Patents
(57) ABSTRACT A method of forming a transition metal containing films on a substrate by a
cyclical deposition process is disclosed. The method may include: contacting the substrate …
cyclical deposition process is disclosed. The method may include: contacting the substrate …