Templating strategies for 3D-structured thermally conductive composites: recent advances and thermal energy applications
Thermally conductive polymer nanocomposites are enticing candidates for not only thermal
managements in electronics but also functional components in emerging thermal energy …
managements in electronics but also functional components in emerging thermal energy …
A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects
Recently, the need for miniaturization and high integration have steered a strong technical
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …
Isotropically ultrahigh thermal conductive polymer composites by assembling anisotropic boron nitride nanosheets into a biaxially oriented network
N Zhao, J Li, W Wang, W Gao, H Bai - ACS nano, 2022 - ACS Publications
The demand for thermally conductive but electrically insulating materials has increased
greatly in advanced electronic packaging. To this end, polymer-based composites filled with …
greatly in advanced electronic packaging. To this end, polymer-based composites filled with …
Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …
excellent insulation, and good mechanical properties. However, as electronic devices …
Deterministic manipulation of heat flow via three-dimensional-printed thermal meta-materials for multiple protection of critical components
Heat dissipation is necessary for the safer operation of high-power electronic devices and
high-capacity batteries. Thermal meta-materials can efficiently manipulate heat flow by …
high-capacity batteries. Thermal meta-materials can efficiently manipulate heat flow by …
Self-standing boron nitride bulks enabled by liquid metals for thermal management
LC Jia, ZX Wang, L Wang, JF Zeng, PY Du, YF Yue… - Materials …, 2023 - pubs.rsc.org
Thermally conductive materials (TCMs) are highly desirable for thermal management
applications to tackle the “overheating” concerns in the electronics industry. Despite recent …
applications to tackle the “overheating” concerns in the electronics industry. Despite recent …
Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation
JW Zha, F Wang, B Wan - Progress in Materials Science, 2024 - Elsevier
Thermal conductivity is critical to the stable operation, service life and reliability of electronic
equipment. Solving thermal management problems in electronic devices requires the …
equipment. Solving thermal management problems in electronic devices requires the …
[HTML][HTML] Thermally conductive composites based on hexagonal boron nitride nanosheets for thermal management: fundamentals to applications
W Wu, M Zheng, K Lu, F Liu, YH Song, M Liu… - Composites Part A …, 2023 - Elsevier
The development of modern electronics and equipment, especially those with high power
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …
Flexible shape-stabilized phase change materials with passive radiative cooling capability for thermal management
LY Yang, CP Feng, L Bai, RY Bao, ZY Liu… - Chemical Engineering …, 2021 - Elsevier
Effective thermal management is of vital importance to resolve the overheating problem of
electronic devices and to decrease energy consumption of buildings. In this work, flexible …
electronic devices and to decrease energy consumption of buildings. In this work, flexible …
Dual‐effect coupling for superior dielectric and thermal conductivity of polyimide composite films featuring “crystal‐like phase” structure
X Dong, B Wan, MS Zheng, L Huang, Y Feng… - Advanced …, 2024 - Wiley Online Library
To match the increasing miniaturization and integration of electronic devices, higher
requirements are put on the dielectric and thermal properties of the dielectrics to overcome …
requirements are put on the dielectric and thermal properties of the dielectrics to overcome …