Insulating materials used for the packaging of integrated circuits play an important role in the
electrical performance of the new System-in-Package (SiP), designed to support flows …

This work demonstrates the use of genetic algorithms (GA) to perform electromagnetic
characterization of dielectric materials. The characterization process entails that the GA …

Face-to-face (F2F)-bonded 3-D ICs provide higher vertical interconnection densities and
cost-effective solutions compared to face-to-back-bonded 3-D ICs. With a bumpless direct …

Abstract 3D integration came as a response to the requirements of high performance and
small footprint electronic devices. Today, the need for more heterogeneous integration …

In the previous chapter, the concept of the SoC, where all system circuitry is placed on one
die, and that die is packaged, was discussed. It was stated that SoC packaging is often …

L'évolution des nœuds technologiques dans l'industrie des semi-conducteurs se traduit de
nos jours, dans le domaine des radiofréquences, par une miniaturisation des front-ends et …

With device scaling, the number and the density of components that can be placed on chip
increase. With every new process generation, more and more active devices can be placed …

三维集 是为满足高性能, 小型封装电子设备的需求而生的. 今天, 随着数字, 模拟/混合信号 (AMS)
和射频电子三 世界的融合, 对具有 多功能的异构集 方案的需求变得 加 显. 高性能计算, 军事 …

Résumé Nous proposons une technique de caractérisation à hautes fréquences (1 GHz 67
GHz) de matériaux diélectriques très simple à mettre en uvre et très bien adaptée à …