Processing and characterization of laser sintered hybrid B4C/cBN reinforced Ti-based metal matrix composite
The purpose of this study is to make a boron carbide (B 4 C) and cubic boron nitride (cBN)
reinforced Ti6Al4V metal matrix composites (MMC's) by direct metal laser sintering (DMLS) …
reinforced Ti6Al4V metal matrix composites (MMC's) by direct metal laser sintering (DMLS) …
Microstructure and electrical property of laser-sintered Cu complex ink
J Lee, B Lee, S Jeong, Y Kim, M Lee - Applied surface science, 2014 - Elsevier
We show that highly conductive Cu films are obtainable from Cu complex ink by laser
sintering. The Cu inks, synthesized using Cu formate as a precursor, were spin-coated onto …
sintering. The Cu inks, synthesized using Cu formate as a precursor, were spin-coated onto …
Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate
H Min, B Lee, S Jeong, M Lee - Optics and Lasers in Engineering, 2016 - Elsevier
We here present a simple, low-cost laser-direct process to fabricate conductive Cu patterns
on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The …
on plastic substrate. A Cu nano-ink was synthesized using Cu formate as a precursor. The …
[PDF][PDF] 有机载体对石墨烯-铜复合浆料性能的影响
屈银虎, 时晶晶, 成小乐, 周宗团, 祁志旭, 袁建才… - 化工新型材料, 2018 - hgxx.org
摘要为提高铜浆的导电性, 选用松油醇G 乙基纤维素系列有机载体, 粒径为10μm
的铜粉为主导电相, 添加少量石墨烯为导电增**相, 熔点为430℃ 的玻璃粉为粘结剂 …
的铜粉为主导电相, 添加少量石墨烯为导电增**相, 熔点为430℃ 的玻璃粉为粘结剂 …
无铅玻璃粉对石墨烯-铜电子浆料性能的影响.
时晶晶, 屈银虎, 周宗团, 成小乐… - Journal of **'an …, 2017 - search.ebscohost.com
为提高铜浆料的导电性, 以微量石墨烯为电子浆料导电增**相, 与贱金属铜粉混合,
加入无铅玻璃粉, 有机载体制备导电性优异的复合电子浆料, 并研究不同熔点玻璃粉及玻璃粉 …
加入无铅玻璃粉, 有机载体制备导电性优异的复合电子浆料, 并研究不同熔点玻璃粉及玻璃粉 …
Enabling eutectic soldering of 3D opto-electronics onto low Tg flexible polymers
MBS Akin, L Rissing… - 2014 IEEE 64th Electronic …, 2014 - ieeexplore.ieee.org
We present a cost-efficient and reproducible technique for assembling 3D components to
mechanically bendable low glass transition temperature (Tg) polymeric interposers. First, we …
mechanically bendable low glass transition temperature (Tg) polymeric interposers. First, we …
[CITAS][C] 微胶囊铜粉对铜复合浆料性能的影响
时晶晶, 屈银虎, 成小乐, 祁志旭, 刘晓妮, 周思君… - 材料科学与工艺, 2017
[CITAS][C] Effect of lead-free glass powders on the graphene-copper electronic pastes
J SHI, Y QU, Z ZHOU, X CHENG, Z QI