HISIM: Analytical Performance Modeling and Design Space Exploration of 2.5 D/3D Integration for AI Computing
Monolithic designs face significant fabrication cost and data movement challenges,
especially when executing complex and diverse AI models. Advanced 2.5 D/3D packaging …
especially when executing complex and diverse AI models. Advanced 2.5 D/3D packaging …
Efficient Orchestrated AI Workflows Execution on Scale-out Spatial Architecture
J Deng, X Tang, Z Yue, G Lu, Q Yang, J Zhang… - ar** and Architecture Co-exploration for Wafer-scale Chips
H Wang, Q Yang, T Wei, X Yu, C Li… - … Circuits and Systems, 2024 - ieeexplore.ieee.org
Transformer-based large language models (LLMs) have made significant strides in the field
of artificial intelligence (AI). However, training these LLMs imposes immense demands on …
of artificial intelligence (AI). However, training these LLMs imposes immense demands on …
Exploring the Suitability of the Cerebras Wafer Scale Engine for the Fast Prototy** of a Multilingual Hate Speech Detection System
M Hoffmann, J John, N Hammer - 2024 IEEE 36th International …, 2024 - ieeexplore.ieee.org
The era of digital communication has brought about a concerning rise of online hate speech.
In response, researchers have focused on develo** automated systems to detect and …
In response, researchers have focused on develo** automated systems to detect and …
Effects of 2.5 D/3D Stacking Structure on Signal Integrity of Chiplet Interconnection
H Mao, H Xu, S Zhang, Y Dai, Z Cai… - 2024 25th International …, 2024 - ieeexplore.ieee.org
In the post-Moore era, the chiplet technology based on advanced packaging would be a
quite promising solution for the high-performance AI chips. The chiplet technology with 2.5 …
quite promising solution for the high-performance AI chips. The chiplet technology with 2.5 …
[PDF][PDF] 硅基光电子及其前沿进展 (特邀)
周治**， 陈卫标， 冯俊波， 杨丰赫， 马德岳… - Acta Optica Sinica …, 2024 - researching.cn
摘要在后摩尔时代的今天, 以小型化和集成化为显著特征的微电子系统和以大传输容量为优势的
光电子系统均已接**发展的极限. 硅基光电子(SBO) 芯片得益于成熟的CMOS 工艺 …
光电子系统均已接**发展的极限. 硅基光电子(SBO) 芯片得益于成熟的CMOS 工艺 …