In order to take the full advantage of the high-temperature SiC and GaN operating devices,
package materials able to withstand high-temperature storage and large thermal cycles …

The need for high power density and high temperature capabilities in today's electronic
devices continues to grow. More robust devices with reliable and stable functioning …

Silver (Ag) has been under development for use as interconnect material for power
electronics packaging since the late 1980s. Despite its long development history, high …

This review traces the development of silver (Ag) as a die attach bonding material in the
microelectronic packaging industry from its' early days as micron-scale silver flakes to the …

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

Planar, double-side cooled power modules are emerging in electric-drive inverters because
of their low profile, better heat extraction, and lower package parasitic inductances …

Sinter joining with Ag particle paste has emerged as a promising lead-free die-attachment
solution for power devices owing to its low-temperature and pressureless processing …

Soldering has been the main die attach technology for several decades. Recently, in order
to meet the high temperature electronic requirements (high temperature-operating SiC and …

During the sintering process, a three-dimensional network-like porous structure forms as the
consequences of atom diffusion and neck formation among silver particles. In this paper, two …

The mechanical properties of sintered Ag paste with microporous structure have been
investigated by tensile and shear tests, focusing on the temperature-dependent plastic …