Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Electronic devices need to work at high temperature in some fields for a long time, peculiarly
step soldering technology, primary packaging and flip–chip connections, etc., along with the …

In this study, the Sn58Bi-xMg (x= 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were
synthesized to explore the impact of Mg particles. The study examined the wettability …

In this study, cobalt (Co) particles were incorporated as reinforcing agents into the Sn58Bi
solder. The solderability of the solder and the strength of the solder joints were investigated …

The thickness of Cusingle bond Sn intermetallic compounds (IMCs) plays a crucial role in
determining the quality of laser soldering joints. However, there is a lack of research on laser …

Sn–Bi based solders are used in electronic packaging for interconnection processes.
However, the rate of research on the comprehensive performance of solders is difficult to …

In this study, the effect of multi-walled carbon nanotubes (MWCNTs) reinforcement on the
intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu …

As one of the key technologies for high performance electronic devices, composite solders
have been developed to improve the thermal and mechanical properties of soldered joints …

The morphological evolution and grain orientations of intermetallic compounds (IMCs) were
investigated during the formation of full Cu 3 Sn joints at two soldering temperatures (310 …

In this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite
solder joints were synthesized and the effects of MWCNTs addition on the microstructure …