High entropy alloys as filler metals for joining
D Luo, Y **ao, L Hardwick, R Snell, M Way… - Entropy, 2021 - mdpi.com
In the search for applications for alloys developed under the philosophy of the High Entropy
Alloy (HEA)-type materials, the focus may be placed on applications where current alloys …
Alloy (HEA)-type materials, the focus may be placed on applications where current alloys …
Iterative machine learning-aided framework bridges between fatigue and creep damages in solder interconnections
Costly and time-consuming approaches for solder joint lifetime estimation in electronic
systems along with the limited availability and incoherency of data challenge the reliability …
systems along with the limited availability and incoherency of data challenge the reliability …
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry
Y Peng, C Li, K **ao, J Yang, C Pu, P Gao, S Guo… - Microelectronics …, 2022 - Elsevier
In this work, we developed Ga-doped Sn-based solders for the microelectronics industry.
The microstructures, melting properties, wetting performance, electrical conductivities …
The microstructures, melting properties, wetting performance, electrical conductivities …
Modelling the effect of Cu content on the microstructure and Vickers microhardness of Sn-9Zn binary eutectic alloy using an artificial neural network
The present study aims to clarify the impact of Cu addition and aging conditions on the
microstructure development and mechanical properties of Sn-9Zn binary eutectic alloy. The …
microstructure development and mechanical properties of Sn-9Zn binary eutectic alloy. The …
Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate
H Liu, Y Wei, Y Zhang, Z Hou, X Zhao - Materials Today Communications, 2023 - Elsevier
Abstract Sn9ZnxBixCu (x= 0, 1.0, 2.0, 3.0 and 4.0 wt%) solder alloys were prepared by
adding different contents of Bi and Cu elements, and the effects of Bi and Cu addition on the …
adding different contents of Bi and Cu elements, and the effects of Bi and Cu addition on the …
Thermal, microstructural, and mechanical features of Bi-containing Sn-1Ag-0.5 Cu lead-free solders
This paper describes the impact of bismuth content on the microstructure, thermal, and
mechanical characteristics of Sn-1Ag-0.5 Cu (SAC105) lead-free solder. A series of SAC105 …
mechanical characteristics of Sn-1Ag-0.5 Cu (SAC105) lead-free solder. A series of SAC105 …
Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0 Ag–0.5 Cu solder alloy
AE Hammad, S El-Molla… - Proceedings of the …, 2023 - journals.sagepub.com
Recently, the application of the magnetic field during the solidification process of alloys has
become of great interest, owing to its ability to enhance microstructures. Hence, the present …
become of great interest, owing to its ability to enhance microstructures. Hence, the present …
Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy
Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–
8Zn–3Bi–xSb (x= 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys …
8Zn–3Bi–xSb (x= 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys …
INFLUENCE OF THERMOMECHANICAL PROCESSING ON MICROMECHANICAL PROPERTIES OF SN-0.7 CU SOLDER ALLOY VIA NANOINDENTATION …
FAM Yusoff, A Jalar - Jurnal Teknologi, 2022 - journals.utm.my
Sn-based solder alloys are commonly utilized in electronic packages as an interconnection.
In this study, nanoindentation was used to explore the impact of thermomechanical …
In this study, nanoindentation was used to explore the impact of thermomechanical …
Evaluation et qualification de la fiabilité des composants et des procédés d'assemblages électroniques pour applications médicales
FE Indmeskine - 2024 - theses.hal.science
L'électronique des DMIAs expose les patients à des risques en cas de défaillance d'un
composant. Contrairement à l'aéronautique, où la redondance est courante, les dispositifs …
composant. Contrairement à l'aéronautique, où la redondance est courante, les dispositifs …