This paper reviews sintered silver (s-Ag) die-attach materials for wide band gap (WBG)
semiconductor packaging. WBG devices that die-attach with s-Ag have attracted a lot of …

In this work, we applied a Ag flake formed paste for sinter-joining on bare Si, SiC, and GaN
surfaces. The sintered joints possess a high shear strength of over 40 MPa under a …

For the accuracy of experimental results, preparing a high quality polished surface and cross-
section of the materials for further analysis using electron back-scattered diffraction (EBSD) …

In this article, an SiC die was directly attached on a bare DBA (Al/AlN/Al) substrate via
micron-sized Ag sintering at 250° C without pressure. The micron-sized structure of the Ag …

For microelectronics packaging, we have previously invented a novel solid-state bonding
technology by using in-situ self-reduction process of surface-state silver oxide. However, the …

Silicon-based materials are widely promising electronic components by the combination
with metals in power electronics field. However, bonding metal and silicon-based materials …

This article presents a wireless packaging design for SiC power device, which displays low
induction, good thermal management performance, and excellent high-temperature …

The metal current collectors used in electronic, energy conversion, and energy storage
devices often have difficulty wetting and adhering to ceramic substrates. Here, a novel …

Thermal stability and characteristic properties of the microstructure of sintered Ag layers
were examined with morphological, crystallographic and mechanical analyses. The sintered …

One of the critical challenges for the protonic ceramic fuel cell stack is sealing electrolytes
and interconnects. However, the traditional Agsingle bondCuO sealant will aggravate the …