Fiber array to chip attach using laser fusion splicing for low loss
With the ever-increasing need for higher data rates, datacom and telecom industries are
now migrating to silicon photonics to achieve higher data rates with reduced manufacturing …
now migrating to silicon photonics to achieve higher data rates with reduced manufacturing …
Fiber-to-Chip Packaging with Robust Fiber Fusion Splicing for Low-Temperature Applications
Photonic Integrated Circuits (PICs) have emerged as a promising technology to support
applications including datacom, AI, RF signal processing, and quantum computing and …
applications including datacom, AI, RF signal processing, and quantum computing and …