The full arrival of 5 G and advances in electronic integration make efficient heat dissipation
crucial for stable operation and longer product lifespan. In this study, a vacuum-assisted …

To meet the higher requirements posed by high-power chips on packaging materials,
designing and fabricating a multi-functional integrated composite is an effective solution. In …

To overcome the shortcomings of epoxy resins (EP) such as high flammability and emission
of toxic gases, a MoS 2-based nanoarchitecture (CeZrO x-MoS 2@ PDA) was designed and …

Polymer self‐lubricating composite coatings have been widely used on the surface of
machinery to extend the life of the moving systems/parts by controlling friction and wear. In …

With the increasing demand for electronics integration and the increasing accumulation of e-
waste, thermal management materials combing high conductivity and sustainability is highly …

With the gradual miniaturization and integration of electronic devices, the design and
development of new high thermal conductivity polymer-based composite materials are …

To further increasing the toughness performance of thermoset resins without sacrificing their
other properties is still a challenge task. In this study, the soft core–soft shell nanoparticles …

The construction of 3D filler networks is an effective strategy to improve the thermal
conductivity of epoxy resins, yet it is still severely limited by the disconnection of conduction …

Flame retardancy and thermal conductivity are contradictory usually. In this paper, furan and
vinyl groups were grafted on the surface of aluminum oxide (Al 2 O 3) and aluminum nitride …

The heat dissipation problem brought about by high heat density components is a key
bottleneck restricting the development of the new electronics industry. At present, traditional …