The interconnection of all things is develo** a new diagram of future information networks.
However, it is difficult to realize future applications with only one single technique …

The three-dimensional Network-on-Chips (3D NoCs) has become a mature multi-core
interconnection architecture in recent years. However, the traditional electrical lines have …

With the advent of complex computing applications such as cloud computing and artificial
intelligence, the utilization of multicore processors has become one of the best solutions to …

In this paper, we propose O-Star, a scalable optical switching architecture for on-chip many-
core systems, employing hybrid mode and wavelength division multiplexing technology. The …

Deep learning has become the most mainstream technology in artificial intelligence (AI)
because it can be comparable to human performance in complex tasks. However, in the era …

This paper proposes a fault-tolerant mechanism including a reliable three-dimensional (3D)
topology structure named 3D DCMesh (3D duel-core connected mesh) and a fault-tolerant …

As a nanometer-level interconnection, the Optical Network-on-Chip (ONoC) was proposed
since it was typically characterized by low latency, high bandwidth and power efficiency …

Nowadays, owing to the advantages of high bandwidth and low power consumption, the
wired optical network-on-chip (W-ONoC) has emerged as a high-performance on-chip …

In recent years, the 3D Network on Chips (3DNoCs) is an optimal solution to use multi-core
processors and overcome the bandwidth limit of electrical connections. The use of optical …

Photonic network on chip was introduced as an efficient communication platform to
overcome the existing challenges in traditional networks on chip. Optical networks provide …