Reliability and variability of advanced CMOS devices at cryogenic temperatures

A Grill, E Bury, J Michl, S Tyaginov… - 2020 IEEE …, 2020 - ieeexplore.ieee.org
In this work, we present time-zero variability and degradation data obtained from a large set
of on-chip devices in specifically designed arrays, from room temperature to 4K. We show …

Predictive hot-carrier modeling of n-channel MOSFETs

M Bina, S Tyaginov, J Franco, K Rupp… - … on Electron Devices, 2014 - ieeexplore.ieee.org
We present a physics-based hot-carrier degradation (HCD) model and validate it against
measurement data on SiON n-channel MOSFETs of various channel lengths, from …

[HTML][HTML] Reliability of miniaturized transistors from the perspective of single-defects

M Waltl - Micromachines, 2020 - mdpi.com
To analyze the reliability of semiconductor transistors, changes in the performance of the
devices during operation are evaluated. A prominent effect altering the device behavior are …

Observation of normally distributed energies for interface trap recovery after hot-carrier degradation

G Pobegen, S Tyaginov, M Nelhiebel… - IEEE electron device …, 2013 - ieeexplore.ieee.org
We investigate the temperature accelerated recovery from hot-carrier (HC) damage with the
help of local polycrystalline heating structures in n-MOSFETs designed for power …

3-D full-band Monte Carlo simulation of hot-electron energy distributions in gate-all-around Si nanowire MOSFETs

M Reaz, AM Tonigan, K Li, MB Smith… - … on Electron Devices, 2021 - ieeexplore.ieee.org
The energy distributions of electrons in gate-all-around (GAA) Si MOSFETs are analyzed
using full-band 3-D Monte Carlo (MC) simulations. Excellent agreement is obtained with …

New Modelling Off-state TDDB for 130nm to 28nm CMOS nodes

T Garba-Seybou, X Federspiel… - 2022 IEEE …, 2022 - ieeexplore.ieee.org
We present a detailed analysis of Off-state Time Dependent Dielectric Breakdown (TDDB)
under non-uniform field performed in MOSFET devices from 28nm FDSOI, 65nm SOI to …

Modeling of hot-carrier degradation in nLDMOS devices: different approaches to the solution of the Boltzmann transport equation

P Sharma, S Tyaginov, Y Wimmer… - … on Electron Devices, 2015 - ieeexplore.ieee.org
We propose two different approaches to describe carrier transport in n-laterally diffused
MOS (nLDMOS) transistor and use the calculated carrier energy distribution as an input for …

Array-Based Statistical Characterization of CMOS Degradation Modes and Modeling of the Time-Dependent Variability Induced by Different Stress Patterns in the …

E Bury, A Chasin, M Vandemaele… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
Degradation mechanisms, such as Bias Temperature Instabilities (BTI) and Hot Carrier
Degradation (HCD), as well as the associated time-dependent variability, dictate the limit on …

Hot-carrier degradation and bias-temperature instability in single-layer graphene field-effect transistors: Similarities and differences

Y Illarionov, A Smith, S Vaziri, M Ostling… - … on electron devices, 2015 - ieeexplore.ieee.org
We present a detailed analysis of hot-carrier degradation (HCD) in graphene field-effect
transistors (GFETs) and compare those findings with the bias-temperature instability (BTI) …

Investigation of the off-state degradation in advanced FinFET technology—Part II: Compact aging model and impact on circuits

Z Sun, Z Wang, R Wang, L Zhang… - … on Electron Devices, 2023 - ieeexplore.ieee.org
Part I of this article revealed that the OFF-state degradation consists of both bias temperature
instability (BTI) and hot carrier degradation (HCD) traps in different channel regions. In part II …