The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

This paper investigates the impact of isothermal aging on the long-term reliability of lead-
free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys …

Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of
time undergo microstructural and mechanical evolution, which degrades the joint electrical …

Lead (Pb)-free solder alloy technology has matured to the point where scientists and
engineers are currently working out the fine points of Pb-free materials, particularly in regard …

This study illustrates test results and comparative literature data on the influence of
isothermal aging and thermal cycling associated with Sn-1.0 Ag-0.5 Cu (SAC105) and Sn …

Pb-free solder joints undergo microstructural and mechanical evolution due to alloy
coarsening and growing intermetallic compounds which degrade the joint electrical …

This study illustrates test results and comparative literature data on the influence of
isothermal aging and thermal cycling associated with Sn-1.0 Ag-0.5 Cu (SAC105) and Sn …

As Pb-free technology increasingly becomes the standard for electronic interconnects and
finishes, engineers must cope with the various challenges posed by this material …

A direct and deleterious effect on packaging reliability has been observed during elevated
temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0 Ag …

The drive for SAC solders in the microelectronics industry presents several new reliability
challenges. Several surface finishes are tested, compare and find the selection of the proper …