Anisotropy dependence of material removal and deformation mechanisms during nanoscratch of gallium nitride single crystals on (0001) plane

C Li, Y Piao, B Meng, Y Zhang, L Li, F Zhang - Applied Surface Science, 2022 - Elsevier
Gallium nitride single crystal (GaN) is difficult to achieve high-efficiency and low-damage
machining due to anisotropy, high hardness and brittleness. Nanoscratch tests of GaN …

Influences of grain size and temperature on tribological characteristics of CuAlNi alloys under nanoindentation and nanoscratch

DQ Doan, TH Fang, TH Chen - International Journal of Mechanical …, 2020 - Elsevier
The mechanical response of CuAlNi nanocrystalline under the nanoscratch through an
abrasive tip sliding on the workpiece is investigated using molecular dynamics (MD) …

Study of nanoscale wear of SiC/Al nanocomposites using molecular dynamics simulations

Z Yin, P Zhu, B Li - Tribology Letters, 2021 - Springer
In this work, molecular dynamics simulations are performed to investigate the nanoscale
wear behavior of SiC particle-reinforced aluminum matrix composites (SiC/Al NCs) through …

Laser-assisted slow tool servo diamond turning of single-crystal silicon for fabricating micro-lens arrays

H Du, D Zhao, C Liu, H Chen, S To - Journal of Manufacturing Processes, 2024 - Elsevier
Single-crystal silicon is extensively applied in electronic devices, but the traditional
ultraprecision diamond turning methods easily cause worse surface quality or surface …

Atomic understanding of elastic-plastic deformation and crack evolution for single crystal AlN during nanoscratch

S Gao, H Lang, H Wang, X Guo, R Kang - Ceramics International, 2023 - Elsevier
Single crystal aluminum nitride (AlN) as a new generation of ultra-wide band gap
semiconductor materials is the preferred substrate material for high power, high RF devices …

Molecular dynamics simulation of nanoindentation on c-plane sapphire

J Lin, F Jiang, X Xu, J Lu, Z Tian, Q Wen, X Lu - Mechanics of Materials, 2021 - Elsevier
Sapphire is a typical hard and brittle material, making it difficult to investigate its plastic
deformation behavior using conventional mechanical experimental methods. Although …

Pile-up and heat effect on the mechanical response of SiGe on Si (0 0 1) substrate during nanoscratching and nanoindentation using molecular dynamics

VT Pham, TH Fang - Computational Materials Science, 2020 - Elsevier
Molecular dynamics (MD) simulations are performed to study the mechanical behavior of
SiGe thin film during nanoindentation and nanoscratching processes. The MD simulations of …

Influence of grain orientation on hardness anisotropy and dislocation behavior of AlN ceramic in nanoindentation

P Tang, J Feng, Z Wan, X Huang, S Yang, L Lu… - Ceramics …, 2021 - Elsevier
The anisotropic hardness, elastic modulus, and dislocation behavior of AlN grains were
investigated by Berkovich nanoindentation. Grain orientation had a strong correlation with …

[HTML][HTML] Atomistic understanding of scratching-induced material attrition of wurtzite single-crystal AlN using nanoscale diamond abrasive

J Guo, S Tan, C **ao - Tribology International, 2022 - Elsevier
The scratching-induced material removal behavior and mechanism of single-crystal AlN
using single diamond abrasive were studied at atomic level through molecular dynamics …

Material removal and surface evolution of single crystal silicon during ion beam polishing

H **ao, Y Dai, J Duan, Y Tian, J Li - Applied Surface Science, 2021 - Elsevier
The ion beam polishing techniques for silicon wafers play a key role in the fabrication of
optical element. However, the dynamical ion beam polishing process at nanoscale time and …