Turnitin
降AI改写
早检测系统
早降重系统
Turnitin-UK版
万方检测-期刊版
维普编辑部版
Grammarly检测
Paperpass检测
checkpass检测
PaperYY检测
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …
Recent progress in SLID bonding in novel 3D-IC technologies
Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential
bonding method applied to 3D chip stacking because it can be bonded at a low temperature …
bonding method applied to 3D chip stacking because it can be bonded at a low temperature …
Copper bonding technology in heterogeneous integration
As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …
technologies have been developed to obtain high performance, high density, low latency …
[HTML][HTML] Surface and interface designs in copper-based conductive inks for printed/flexible electronics
Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-
based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising …
based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising …
Advanced Cu/polymer hybrid bonding system for fine‐pitch 3D stacking devices
Hybrid bonding enables the commercialization of ultra‐fine pitch high‐density 3D packages.
Cu/SiO2 hybrid bonding is the standard packing interface recently introduced in the industry …
Cu/SiO2 hybrid bonding is the standard packing interface recently introduced in the industry …
Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces
Cu nanoparticle sintering bonding is a low-cost die-attach method compared with Ag
nanoparticles for power electronic packaging. The joint strength highly depends on the …
nanoparticles for power electronic packaging. The joint strength highly depends on the …
[HTML][HTML] Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale
Due to the excellent electrothermal properties, outstanding resistance to electromigration
and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for …
and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for …
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
The development of WBG (wide bandgap) semiconductors has put forward higher
requirements for packaging and interconnection technology. Cu sintering is widely …
requirements for packaging and interconnection technology. Cu sintering is widely …
Review on shear strength and reliability of nanoparticle sintered joints for power electronics packaging
The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …
Epsilon-near-zero response derived from collective oscillation in the metacomposites with ultralow plasma frequency
Nowadays, negative parameters have been originally brought up and investigated in the
electromagnetic metamaterial, where the epsilon-near-zero (ENZ) response was dominated …
electromagnetic metamaterial, where the epsilon-near-zero (ENZ) response was dominated …