Brazing, as a common method of bonding ceramic and metal, has been applied in
microelectronics, aerospace, machinery and other domains extensively. The residual …

As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …

In recent years, selective laser melting (SLM)-NiTi had developed rapidly due to the ability to
achieve the complex shape and internal features, as well as high dimensional accuracy. The …

Hybrid bonding enables the commercialization of ultra‐fine pitch high‐density 3D packages.
Cu/SiO2 hybrid bonding is the standard packing interface recently introduced in the industry …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

To rapidly form a highly thermal-conductive line structure that could be sustained even at
high temperatures such as 300° C, the compression (5 MPa)-assisted sintering of a Ag …

In order to understand the microstructure evolution characteristics of AlCoCrFeNi high
entropy alloy (HEA) coating at high environmental temperatures, a laser cladded …

Microelectronic devices have demonstrated advanced capabilities, including
multifunctionality and high input-output density, rendering them widely used in significant …

A BCC-structural refractory-high-entropy-alloy (RHEA) composition of (TiZrNb) 14 AlMo (Al
6.25 Mo 6.25 Ti 29.2 Zr 29.2 Nb 29.2, at.%) was designed by cluster-plus-glue-atom model …

The morphology and content of the silver fillers, resin matrix composition and curing process
could significantly affect performance properties of electrically conductive adhesives (ECAs) …