Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Recent fluid–structure interaction modeling challenges in IC encapsulation–A review
CY Khor, MZ Abdullah, CS Lau, IA Azid - Microelectronics Reliability, 2014 - Elsevier
The rapid development of computing software has facilitated multifarious research in
integrated circuit (IC) packaging. Complicated and complex processes can be visualized via …
integrated circuit (IC) packaging. Complicated and complex processes can be visualized via …
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
Consistent with the recent trends in which the flip-chip reliability and performance being
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …
prominently prioritized, this paper is devoted to study the effects of solder bump shapes on …
Spatial analysis of underfill flow in flip-chip encapsulation
Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering
An effective simulation approach is introduced in this paper to study the thermal fluid-
structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the …
structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the …
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
Recent trend in electronic industries are demanding smaller chip packaging process along
with increase in performance and reliability of the package. The introduction of Multi-stack …
with increase in performance and reliability of the package. The introduction of Multi-stack …
Alkali extraction of phenolic compounds from tomato peel: optimization of extraction conditions and investigation of phenolic profile by LC-MS/MS
ÖK Esmer, E Koçak, AE Cevrem… - Turkish Journal of …, 2022 - agrifoodscience.com
With the increasing world population, the food need of humanity is increasing proportionally.
Agricultural wastes constitute an important potential for the global economy as they contain …
Agricultural wastes constitute an important potential for the global economy as they contain …
Influence of solder bump arrangements on molded IC encapsulation
CY Khor, MZ Abdullah, CS Lau, WC Leong… - Microelectronics …, 2014 - Elsevier
This paper presents a fluid–structure interaction (FSI) analysis of ball grid array (BGA)
package encapsulation. Real-time and simultaneous FSI analysis is conducted by using …
package encapsulation. Real-time and simultaneous FSI analysis is conducted by using …
Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation
This paper presents the effect of chip stacking in a 3D integrated circuit package during
plastic encapsulation. An experiment was conducted on four stacked chips with bumps in a …
plastic encapsulation. An experiment was conducted on four stacked chips with bumps in a …
A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
Underfill encapsulation process regularly encounters productivity issue of long filling time
that incurs additional manufacturing costs. The package was optimized to attain least filling …
that incurs additional manufacturing costs. The package was optimized to attain least filling …