Experimental study of an aluminum based three-dimensional thermosyphon heat sink with microscale enhancement structure
X Yang, S Bu, Z Jiang, Y Zhou, Z Sun, Y Zhang… - Applied Thermal …, 2024 - Elsevier
One of the most significant limitations to the advancement of electronics is the issue of heat
dissipation. Currently, air cooling remains the most widely used method for heat dissipation …
dissipation. Currently, air cooling remains the most widely used method for heat dissipation …
Effect of the Geometrical Parameter of Open Microchannel on Pool Boiling Enhancement
High heat dissipation is required for miniaturization and increasing the power of electronic
systems. Pool boiling is a promising option for achieving efficient heat dissipation at low wall …
systems. Pool boiling is a promising option for achieving efficient heat dissipation at low wall …