Purpose There are several lead-free solder alloys available in the industry. Over the years,
the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly …

This paper provides an analytical solution to solve for the electronic assembly random
vibration problem. Additionally, this paper employs Taguchi method to investigate the fatigue …

Purpose Because of growing demand for slim, thin and cheap handheld devices, reduced-
volume solder interconnects like land grid array (LGA) are becoming attractive and popular …

This paper presents solder joint thermal cycling fatigue life analysis and optimization study
using finite element analysis (FEA) and design of experiments (DoE) statistical methods. In …

Previously crack propagation and joint failure in thermal cycling tests were correlated with
recrystallization of Sn grains in SnAgCu (SAC) ball grid array (BGA) solder joints. Generally …

Purpose This paper aims to investigate the fatigue life performance of SAC305 ball grid
array solders under combined temperature and harmonic vibration loading conditions …

Accelerated testing of microelectronics products and/or specially designed test vehicles may
be useless or worse unless the results can be counted on to somehow reflect performance …

This paper presents a comprehensive finite element analysis study on the effect of the
support and fixation schemes on the dynamic characteristics and fatigue life of electronic …

Purpose This paper aims to investigate and compare the reliability performance of land grid
array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder …

This paper presents an analytical solution for the electronic assembly subjected to shock
loading transient analysis problem. A previously published solution is adopted here and …