The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

We investigated thermal properties of the epoxy-based composites with the high loading
fraction—up to f≈ 45 vol%—of the randomly oriented electrically conductive graphene fillers …

Almost 15 years have gone ever since the discovery of graphene as a single atom layer.
Numerous papers have been published to demonstrate its high electron mobility, excellent …

The synthesis and characterization of epoxy‐based composites with few‐layer graphene
fillers, which are capable of dual‐functional applications, are reported. It is found that …

To meet the increasing demands for effective heat management of electronic devices, a
graphene-based polymeric composite is considered to be one of the candidate materials …

Abstract Development of next‐generation thermal interface materials (TIMs) with high
thermal conductivity is important for thermal management and packaging of electronic …

Heat management is more and more crucial challenge since the development of modern
electronic devices towards miniaturization and high dense integrity. Highly thermal …

Meteoric breakthroughs in the integration and shrinkage of electronic devices in the last few
years made thermal management a critical issue affecting the lifetime, performance, and …

A heat sink is a specific type of heat exchanger integrated with heat generating devices-
mostly electronics-for the sake of thermal management. In the design procedure of heat …