The heat dissipation issue has now become one of the most important bottlenecks for power
electronics due to the rapid increase in power density and working frequency. Towards the …

Thermoreflectance-based techniques, such as pump–probe thermoreflectance (pump–
probe TR) and thermoreflectance thermal imaging (TTI), have emerged as the powerful and …

High thermal conductivity electronic materials are critical components for high-performance
electronic and photonic devices as both active functional materials and thermal …

High thermal conductivity materials show promise for thermal mitigation and heat removal in
devices. However, shrinking the length scales of these materials often leads to significant …

With significant recent advancements in thermal sciences—such as the development of new
theoretical and experimental techniques, and the discovery of new transport mechanisms—it …

The precision with which hadronic vacuum polarization (HVP) is obtained determines how
accurately important observables, such as the muon anomalous magnetic moment a μ or the …

Dislocations play an important role in thermal transport by scattering phonons. Nevertheless,
for materials with intrinsically low thermal conductivity, such as thermoelectrics, classical …

Phonon engineering is crucial for thermal management in GaN-based power devices, where
phonon-defect interactions limit performance. However, detecting nanoscale phonon …

Wide and ultrawide bandgap semiconductors, such as GaN, play a crucial role in high-
power applications, yet their performance is often constrained by thermal management …

Measuring the thermal conductivity of sub-surface buried substrates is of significant practical
interests. However, this remains challenging with traditional pump–probe spectroscopies …