Investigation of crosstalk issues for MWCNT bundled TSVs in ternary logic

JB Shaik, P Venkatramana - ECS Journal of Solid State Science …, 2022 - iopscience.iop.org
The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …

Crosstalk analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects for ternary logic system using unconditionally stable FDTD model

G Deepthi, M Tatineni - Microelectronics Journal, 2023 - Elsevier
In the present work, for examining the performance of dielectric inserted side contact
multilayer graphene nano ribbon (DSMLGNR), a novel Unconditionally Stable Finite …

Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs

A Kumar, R Dhiman - Microelectronics Journal, 2023 - Elsevier
In this paper, a computationally efficient matrix rational approximation (MRA) technique is
developed to analyze the electrical behaviour of through packaging vias in glass interposer …

Proposal and analysis of carbon nanotube based differential multibit through glass vias

A Kumar, R Chandel, R Dhiman - Microelectronics Journal, 2022 - Elsevier
The paper proposes glass as a potential material to advanced interposers for high-density
three-dimensional (3-D) integration. On the basis of multi-bit through glass via (TGV) which …

High-Frequency Electromagnetic Eddy Effect Modeling for Cylindrical and Tapered Bump

S Chandrakar, D Gupta, MK Majumder… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
In recent 3-D integrated circuits, tapered-shaped bumps (T-bump) have provided an
appealing solution over the conventional cylindrical (C-bump) structures due to their …

Modeling and performance analysis of MWCNT bundle interconnect based on state space method

S Zhao, F Deng - Materials Research Express, 2025 - iopscience.iop.org
To efficiently analyze the time-domain and frequency-domain characteristics of novel
interconnects, this paper focuses on multi-walled carbon nanotube (MWCNT) bundle …

[HTML][HTML] Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic

K Rajkumar, GU Reddy - e-Prime-Advances in Electrical Engineering …, 2023 - Elsevier
This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial
through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled …

Design of Efficient RAM Cell using Quantum-Dot Cellular Automata

VR Kumar, GP Kumar, M Girish… - … Engineering & their …, 2024 - ieeexplore.ieee.org
This paper presents a novel Quantum Dot Cellular Automata (QCA)-based Random Access
Memory (RAM) cell design that enhances output voltage performance using a loop structure …

Temperature Dependent Analysis of Mixed CNT Bundle Interconnecting using Active Shielding Technique

CP Kumar, ES Rao, PC Sekhar - ECS Journal of Solid State …, 2022 - iopscience.iop.org
The cumulative increase of resistivity in copper due to scaling and indispensable
requirements of high current densities and unprecedented switching speed are the impelling …