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Investigation of crosstalk issues for MWCNT bundled TSVs in ternary logic
The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …
Crosstalk analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects for ternary logic system using unconditionally stable FDTD model
In the present work, for examining the performance of dielectric inserted side contact
multilayer graphene nano ribbon (DSMLGNR), a novel Unconditionally Stable Finite …
multilayer graphene nano ribbon (DSMLGNR), a novel Unconditionally Stable Finite …
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs
In this paper, a computationally efficient matrix rational approximation (MRA) technique is
developed to analyze the electrical behaviour of through packaging vias in glass interposer …
developed to analyze the electrical behaviour of through packaging vias in glass interposer …
Proposal and analysis of carbon nanotube based differential multibit through glass vias
The paper proposes glass as a potential material to advanced interposers for high-density
three-dimensional (3-D) integration. On the basis of multi-bit through glass via (TGV) which …
three-dimensional (3-D) integration. On the basis of multi-bit through glass via (TGV) which …
High-Frequency Electromagnetic Eddy Effect Modeling for Cylindrical and Tapered Bump
In recent 3-D integrated circuits, tapered-shaped bumps (T-bump) have provided an
appealing solution over the conventional cylindrical (C-bump) structures due to their …
appealing solution over the conventional cylindrical (C-bump) structures due to their …
Modeling and performance analysis of MWCNT bundle interconnect based on state space method
S Zhao, F Deng - Materials Research Express, 2025 - iopscience.iop.org
To efficiently analyze the time-domain and frequency-domain characteristics of novel
interconnects, this paper focuses on multi-walled carbon nanotube (MWCNT) bundle …
interconnects, this paper focuses on multi-walled carbon nanotube (MWCNT) bundle …
[HTML][HTML] Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic
K Rajkumar, GU Reddy - e-Prime-Advances in Electrical Engineering …, 2023 - Elsevier
This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial
through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled …
through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled …
Design of Efficient RAM Cell using Quantum-Dot Cellular Automata
VR Kumar, GP Kumar, M Girish… - … Engineering & their …, 2024 - ieeexplore.ieee.org
This paper presents a novel Quantum Dot Cellular Automata (QCA)-based Random Access
Memory (RAM) cell design that enhances output voltage performance using a loop structure …
Memory (RAM) cell design that enhances output voltage performance using a loop structure …
Temperature Dependent Analysis of Mixed CNT Bundle Interconnecting using Active Shielding Technique
CP Kumar, ES Rao, PC Sekhar - ECS Journal of Solid State …, 2022 - iopscience.iop.org
The cumulative increase of resistivity in copper due to scaling and indispensable
requirements of high current densities and unprecedented switching speed are the impelling …
requirements of high current densities and unprecedented switching speed are the impelling …