Purpose This paper aims to present a new method of real-time monitoring of thermal profiles
applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a …

Purpose–The purpose of this paper is to compare the reliability and intermetallic layer (IML)
of solder joints prepared with infrared (IR) and vapour phase (VP) soldering. The reliability of …

Purpose The purpose of this paper is to investigate measurement and regulation of
saturated vapour height level in vapour phase soldering (VPS) chamber based on parallel …

The heat and mass transport processes were investigated with numerical simulations in a
vacuum vapour phase soldering system during the vapour suctioning process. Low vapour …

The paper aims to review the process of vapour phase soldering (VPS) by using heat level
(HL) mode. The origin of vapour phase soldering (VPS), the factors involved to control the …

Purpose This paper aims to present a review of the recent developments in vapour phase
soldering (VPS) technology. This study focuses on the following topics: recent developments …

The paper presents a practical method for calculating the heat transfer during Vapour Phase
Soldering (VPS) process. VPS is a reflow soldering method based on condensation heating …

In this paper, heat transfer and condensate layer formation was investigated by numerical
simulations on the top side of inclined printed circuit boards during vapour phase soldering …

During vapour phase reflow soldering used in electronics manufacturing, the process control
of ovens is usually based on temperature measurements, which can be insufficient due to …

Purpose Vapor phase soldering (VPS), also known as condense soldering, is capable of
improving the mechanical reliability of solder joints in electronic packaging structures. The …