Stacked semiconductor die assemblies with multiple thermal paths and associated systems
and methods are disclosed herein. In one embodiment, a semiconductor die assembly can …

(57) ABSTRACT A semiconductor die assembly comprises a plurality of semi conductor dice
in a stack. Another semiconductor die is adja cent to the stack and has a region, which may …

(57) ABSTRACT A package includes a die Stack that includes at least two stacked dies, and
a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top …

The present invention is directed to a transport package which efficiently maintains payload
temperature within a predeter mined temperature range during delivery through regions …

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment, as …

Cooling devices, packaged semiconductor devices, and methods of packaging
semiconductor devices are disclosed. In some embodiments, a cooling device for a …

There is provided a semiconductor device including a Sub strate whose Surface is made of
an insulation material, a semiconductor chip flip-chip connected on the Substrate, and a …

This document discusses, among other things, a semiconductor die package having a first
and a second discrete components embedded into a dielectric substrate. An integrated …

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip
packages to facilitate better heat spreading and dissipation. The heat spreading cap com …

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