As a carrier of deformation information, the speckle pattern, or more exactly the random
intensity distributions, which could be naturally occurred or artificially fabricated onto test …

Electronics subjected to shock and vibration may experience strain rates of 1-100 sec-1.
High strain rate data is scarce for leadfree solders at strain rates in the range of 1-100 sec-1 …

Electronics may be subjected to shock, vibration, and drop-impact during ship**, handling
and during normal usage. Measurement of transient dynamic deformation of the electronics …

Relative damage-index based on the leadfree interconnect transient strain history from
digital image correlation, explicit finite-elements, cohesive-zone elements, and component's …

In this paper, a design-envelope approach based on optical feature extraction techniques
has been investigated for drop and shock survivability of electronic packaging has been …

We present a new computational formulation for inverse problems in elasticity with full field
data. The formulation is a variant of an error in the constitutive equation formulation, but …

Electronic packages subjected to drop and shock have been simulated using alternative
theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are …

Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …

Electronic components may be subjected to significant deformation under the action of
thermal and mechanical loads during operation and storage. The use of thin material layers …

Electronics in aerospace applications may be subjected to very high g-loads during normal
operation. A novel micro-coil array interconnect has been studied for increased reliability …